CEATEC JAPAN 2010 Oct.5th (Tue.) to Oct.9 (Sat.), 2010 Makuhari Messe, Tokyo

Utility

Exhibitor詳細情報

Ceatec Suite

Tatsuta Electric Wire & Cable Co., Ltd.

URL1:http://www.tatsuta.com/en

2-3-1, Iwata-cho Higashiosaka city,  Osaka Japan

Zone Electronics Zone
Hall hall8
Planned Exhibition Product Categories [Metals],[Other materials],[Other elemental technologies]

Booth Location

8L69

  • Introduction
  • お問合せ先
  • For Press

Introduction

Must-see Item

Thermoplastic type anisotropically conductive bonding paste "CBP-700"

Product Category:Smartphones, Cellular telephones, Personal Handyphone System (PHS)

CBP-700 is Halogen free & Thermoplastic type anisotropically conductive bonding paste for Touch Panel. Stable joint reliability is appeared on Touch Panel and Flexible connector as we have been controlling the size of metallic filler and our dispersion technology.

Introduction-1

EMI Shielding Film "SF-PC series" for FPC

Product Category:Smartphones, Cellular telephones, Personal Handyphone System (PHS)

We release 8 um Super thin EMI Shielding Film.
And it has other excellent features, its sliding or bending life is over 1 million cycles with radius at 0.65 mm and temperature from -20 to 65 deg. C. Although it is Halogen free, it is excellent nonflammable (We have been applying for a flame class UL94, VTM-0).
Actually it is super thin type, but it has the same features of SF-PC5000 like shielding characteristics and the processing condition is also same as that of SF-PC5000.
This thinner and lighter one can give you further assistance.
1)SF-PC6000:EMI Shielding film for FPC, especially for a High step.
2)SF-PC5900:8 um Super thin EMI Shielding Film/UL recognized component
3)SF-PC5500:UL recognized component
4)SF-PC5000:Standard type

Introduction-2

Free Grounding Film "FGF-400"

Product Category:Smartphones, Cellular telephones, Personal Handyphone System (PHS)

FGF-400 is a supplementary material to connect Ground joint on a top of TATSUTA EMI Shielding film.
It can meet a freedom of design, because although after bonding TATSUTA EMI shielding film you can take GND interconnection on TATSUTA EMI shielding film freely.

Other Introduction

1)Conductive paste for Thermal Via Filling "AE1244" 10.5W/mK
2)Conductive Bonding Film "CBF-300"
3)Reflow Protection Tape "RPT-150"

Contact

〒578-8585
2-3-1, Iwata-cho, Higashi-Osaka city, Osaka JAPAN
[TEL] +81.6.6721.3321  [FAX] +81.6.6721.3097
Electronic Materials & System Equipment Group Functional Materils Division
Yoko Kashiwagi
[email1] kashiwagi@tatsuta.com
[URL] http://www.tatsuta.com

Press

〒578-8585
2-3-1, Iwata-cho, Higashi-Osaka city, Osaka JAPAN
[TEL] +81.6.6721.3321  [FAX] +81.6.6721.3097
Electronic Materials & System Equipment Group Functional Materils Division
Yoko Kashiwagi
[email1] kashiwagi@tatsuta.com
[URL] http://www.tatsuta.com

 

Reference

  • Exhibit CEATEC

organizer

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  • JEITA
  • CSAJ
Green IT Pavilion
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  • Smart Grid
  • IEICE